CMP service for prototyping and low volume production
| Autor: | K. Torki, Bernard Courtois |
|---|---|
| Přispěvatelé: | Techniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés (TIMA), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Centre National de la Recherche Scientifique (CNRS), Torella, Lucie, Techniques of Informatics and Microelectronics for integrated systems Architecture (TIMA), Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP)-Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes (UGA) |
| Jazyk: | angličtina |
| Rok vydání: | 2005 |
| Předmět: |
Microelectromechanical systems
Bulk micromachining Materials science [SPI.NANO] Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics 02 engineering and technology Integrated circuit Integrated circuit design High-electron-mobility transistor BiCMOS 020202 computer hardware & architecture law.invention Surface micromachining PACS 8542 CMOS law 0202 electrical engineering electronic engineering information engineering Electronic engineering [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics |
| Zdroj: | CEPA 2 Workshop Digital Platforms for Defence CEPA 2 Workshop Digital Platforms for Defence, Mar 2005, Brussels, Belgium. pp.429-436 |
| Popis: | CMP aims at providing universities, research laboratories and industries with the possibility to have their integrated circuits projects fabricated for prototyping and low volume production. Presently, users are serviced for CMOS double layer poly/double layer metal (DLP/DLM) 0.8, DLM/TLM 0.6mu, DLP/4LM 0.35mu, SLP/6LM 0.18mu, SLP/6LM 0.13mu, SLP/7LM 90nm, BiCMOS DLP/DLM 0.8mu, SiGe 0.35mu SLP/5LM, SiGe:C 0.25mu SLP/5LM and GaAs HEMT 0.2mu. About 40 multi-project runs are offered per year. Micro electro mechanical systems (MEMS) are also provided in standard CMP runs in CMOS DLP/DLM 0.8mu 0.6mu, BiCMOS DLP/DLM 0.8mu and HEMT GaAs 0.2mu, using compatible front-side bulk micro-machining. MUMPS processes are offered as surface micro-machining allowing integrating MEMS only microstructures |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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