Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding
| Autor: | Christian Koos, Wolfgang Freude, T. Hoose, Aleksandar Nesic, Philipp-Immanuel Dietrich, Pablo Marin-Palomo, Ute Troppenz, Martin Moehrle, Matthias Blaicher, Andreas Hofmann, M. R. Billah, Nicole Lindenmann, Sebastian Randel |
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| Přispěvatelé: | Publica, Mechanics of Materials and Constructions, Brussels Photonics Team, Applied Physics and Photonics |
| Jazyk: | angličtina |
| Rok vydání: | 2018 |
| Předmět: |
Wire bonding
Materials science ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION Physics::Optics FOS: Physical sciences 02 engineering and technology Applied Physics (physics.app-ph) 01 natural sciences law.invention 010309 optics chemistry.chemical_compound law 0103 physical sciences Hardware_INTEGRATEDCIRCUITS Lithography Engineering & allied operations Electronic circuit Silicon photonics business.industry Physics - Applied Physics 021001 nanoscience & nanotechnology Chip Laser Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials chemistry Indium phosphide Optoelectronics Photonics ddc:620 0210 nano-technology business Physics - Optics Optics (physics.optics) |
| Zdroj: | Optica, 5 (7), 876-883 Optica |
| ISSN: | 2334-2536 |
| Popis: | Efficient coupling of III-V light sources to silicon photonic circuits is one of the key challenges of integrated optics. Important requirements are low coupling losses, as well as small footprint and high yield of the overall assembly, along with the ability to use automated processes for large-scale production. In this paper, we demonstrate that photonic wire bonding addresses these challenges by exploiting direct-write two-photon lithography for in-situ fabrication of three-dimensional freeform waveguides between optical chips. In a series proof-of-concept experiments, we connect InP-based horizontal-cavity surface emitting lasers (HCSEL) to passive silicon photonic circuits with insertion losses down to 0.4 dB. To the best of our knowledge, this is the most efficient interface between an InP light source and a silicon photonic chip that has so far been demonstrated. Our experiments represent a key step in advancing photonic wire bonding to a universal integration platform for hybrid photonic multi-chip assemblies that combine known-good dies of different materials to high-performance hybrid multi-chip modules. Comment: 9 pages, 5 figures |
| Databáze: | OpenAIRE |
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