Identification of kissing defects in adhesive bonds using infrared thermography
| Autor: | Janice M. Dulieu-Barton, Rachael C. Tighe, Simon Quinn |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
Materials science
Polymers and Plastics Silicon General Chemical Engineering chemistry.chemical_element 02 engineering and technology 01 natural sciences Biomaterials Stress (mechanics) C. thermal analysis Thermoelastic damping pulse phase thermography 0103 physical sciences Grease kissing defects Composite material 010302 applied physics C. non-destructive testing Fibre-reinforced plastic 021001 nanoscience & nanotechnology B. composites Lap joint chemistry Thermography Adhesive 0210 nano-technology |
| Zdroj: | Tighe, R C, Barton, J M & Quinn, S 2016, ' Identification of kissing defects in adhesive bonds using infrared thermography ', International Journal of Adhesion and Adhesives, vol. 64, pp. 168-178 . https://doi.org/10.1016/j.ijadhadh.2015.10.018 |
| ISSN: | 0143-7496 |
| DOI: | 10.1016/j.ijadhadh.2015.10.018 |
| Popis: | A carbon fibre reinforced plastic (CFRP) adhesively bonded single lap joint sample is used for comparing the detection of different defect types using pulsed phase thermography (PPT). Firstly, a polytetrafluoroethene (PTFE) insert, of the type widely used to simulate defects in composite materials, was added to the bond line of the joint. Liquid layer kissing defects were simulated using silicon grease. PPT clearly identified the PTFE but not the silicon grease contamination. The PPT identified the silicon grease defect when the joint was loaded. It is postulated that kissing defects can be detected using thermography if a small load is applied to the joint, as loading opens the defect and produces a gap that provides sufficient thermal contrast for detection. Thermoelastic stress analysis (TSA) is used to validate the approach. On-site application is addressed both in terms of the load application and the use of low cost infrared (IR) detectors. |
| Databáze: | OpenAIRE |
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