Novel mask-less plating metallization route for bifacial silicon heterojunction solar cells
Autor: | Vivek P. Mehta, Sven Kluska, Mike Jahn, Jonas Bartsch, Markus Glatthaar, Dietmar Borchert, Thibaud Hatt |
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Rok vydání: | 2018 |
Předmět: |
Materials science
business.industry 020209 energy Lab scale 02 engineering and technology Electrolyte 021001 nanoscience & nanotechnology 7. Clean energy law.invention law Plating Solar cell 0202 electrical engineering electronic engineering information engineering Copper plating Silicon heterojunction Optoelectronics 0210 nano-technology Electroplating business Layer (electronics) |
Zdroj: | AIP Conference Proceedings volume 1999 |
ISSN: | 0094-243X |
DOI: | 10.1063/1.5049272 |
Popis: | The proof of concept of a novel metallization route for bifacial silicon heterojunction (SHJ) solar cells by selective plating – i.e. organic mask-free, is demonstrated by a first lab scale solar cell (η=15.5%). A patterned metal-seed is inkjet-printed or deposited by PVD on a PVD-Al layer covering the ITO layer. The copper electroplating process is investigated considering different electrolytes and plating settings in order to selectively cover the metal-seed and not the PVD Al layer. As well a processing chemistry to etch the PVD-Al layer without affecting the ITO and the electroplated contact is presented. |
Databáze: | OpenAIRE |
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