IoT: source of test challenges
| Autor: | Bohan Yang, Cocoy Reyes, Cedric Mayor, Dave Singelée, Peter Cockburn, Ingrid Verbauwhede, Yervant Zorian, Vladimir Rozic, Mario Konijnenburg, Erik Jan Marinissen, Robert van Rijsinge, Ping-Hsuan Hsieh, Chih-Tsun Huang, Jeroen Delvaux |
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| Přispěvatelé: | Electronic Systems |
| Jazyk: | angličtina |
| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
Engineering business.industry Real estate 02 engineering and technology Computer security computer.software_genre 01 natural sciences 020202 computer hardware & architecture Semiconductor industry Sight 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Internet of Things business Telecommunications Energy harvesting computer |
| Zdroj: | Proceedings-2016 21st IEEE European Test Symposium, ETS 2016 ETS |
| DOI: | 10.1109/ets.2016.7519331 |
| Popis: | The semiconductor industry has been driving a major part of its growth through first the PC and more recently the mobile market. Unfortunately, the PC market is in decline and also the end of the growth curve for mobile products is in sight now that virtually everyone on the planet has a smartphone and/or tablet. Hence, the semiconductor industry is putting its bets on 'Internet of Things' (IoT) as the next application wave that will allow them to sell a lot of silicon real estate. Although what exactly IoT encompasses is under definition and hence still volatile, the first emerging products depict an image which is quite different from the traditional microprocessors or smartphone SOCs: small but with ubiquitous presence, wirelessly connected, energy harvesting, equipped with smart sensors, secure, and low cost. All these aspects have a profound impact on the challenges, solutions, and associated trade-offs for testing IoT chips and provide rich grounds for research. This paper provides seven views from different angles. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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