Stress dissipation in cucurbit[8]uril ternary complex small molecule adhesives
| Autor: | Oren A. Scherman, Zarah Walsh-Korb, Samuel T. Jones, Yang Lan, Paul H. Williams |
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| Přispěvatelé: | Scherman, Oren [0000-0001-8032-7166], Apollo - University of Cambridge Repository |
| Jazyk: | angličtina |
| Rok vydání: | 2018 |
| Předmět: |
0306 Physical Chemistry (incl. Structural)
Materials science 010405 organic chemistry Supramolecular chemistry Cooperativity 02 engineering and technology Surfaces and Interfaces Adhesion 0303 Macromolecular and Materials Chemistry 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Small molecule 0104 chemical sciences Stress (mechanics) Chemical engineering Behavioral and Social Science Electrochemistry General Materials Science Adhesive Mica 0210 nano-technology Ternary complex Spectroscopy |
| Zdroj: | Jones, S 2018, ' Stress dissipation in cucurbit[8]uril ternary complex small molecule adhesives ', Langmuir . https://doi.org/10.1021/acs.langmuir.8b00894 Samuel T. Jones |
| DOI: | 10.1021/acs.langmuir.8b00894 |
| Popis: | The ability to control supramolecular and macroscopic self-assembly and disassembly holds great potential for responsive, reversible adhesives that can efficiently broker stresses accumulated between two surfaces. Here, cucurbit[8]uril is used to directly adhere two functionalized mica substrates creating surface–surface interactions that are held together through photoreversible CB[8] heteroternary complexes. Comparison of single-molecule, bulk, and macroscopic adhesion behavior give insight into cooperativity and stress dissipation in dynamic adhesive systems. |
| Databáze: | OpenAIRE |
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