High Temperature Silicon Carbide Power Modules for High Performance Systems
| Autor: | Marcelo Schupbach, W. Cilio, Jared Hornberger, Alexander B. Lostetter, Bradley A. Reese, B. McPherson, Robert Shaw, Edgar Cilio, E. Heinrichs, Jack Bourne, Ty McNutt |
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| Rok vydání: | 2011 |
| Předmět: |
Materials science
Silicon business.industry Mechanical Engineering Electrical engineering chemistry.chemical_element High voltage Condensed Matter Physics Engineering physics chemistry.chemical_compound Reliability (semiconductor) Semiconductor chemistry Mechanics of Materials Power electronics Power module Silicon carbide General Materials Science Pharmacology (medical) business Power density |
| Zdroj: | Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:000159-000166 |
| ISSN: | 2380-4491 |
| DOI: | 10.4071/hiten-paper5-jhornberger |
| Popis: | The demands of modern high-performance power electronics systems are rapidly surpassing the power density, efficiency, and reliability limitations defined by the intrinsic properties of silicon-based semiconductors. The advantages of silicon carbide (SiC) are well known, including high temperature operation, high voltage blocking capability, high speed switching, and high energy efficiency. In this discussion, APEI, Inc. presents two newly developed high performance SiC power modules for extreme environment systems and applications. These power modules are rated to 1200V, are operational at currents greater than 100A, can perform at temperatures in excess of 250 °C, and are designed to house various SiC devices, including MOSFETs, JFETs, or BJTs. One newly developed module is designed for high performance, ultra-high reliability systems such as aircraft and spacecraft, and features a hermetically sealed package with a ring seal technology capable of sustaining temperatures in excess of 400°C. The second module is designed for high performance commercial and industrial systems such as hybrid electric vehicles or renewable energy applications, implements a novel ultra-low parasitic packaging approach that enables high switching frequencies in excess of 100 kHz, and weighs in at just over 130 grams (offering ~5× mass reduction and ~3× size reduction in comparison with industry standard power brick packaging technology). It is configurable as either a half or full bridge converter. In this discussion, APEI, Inc. introduces these products and presents practical testing of each. |
| Databáze: | OpenAIRE |
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