Short Channel effects and drain field relief architectures in polysilicon TFTs
Autor: | Antonio Valletta, Luca Maiolo, M. Cuscunà, Alessandro Pecora, Matteo Rapisarda, Luigi Mariucci, S.D. Brotherton, Guglielmo Fortunato |
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Jazyk: | angličtina |
Rok vydání: | 2011 |
Předmět: |
Materials science
business.industry Polysilicon depletion effect Electrical engineering Short-channel effect engineering.material Active matrix law.invention Polycrystalline silicon Thin-film transistor law engineering Optoelectronics business Septic drain field Communication channel Electronic circuit |
Zdroj: | ECS transactions 37 (2011): 3–14. doi:10.1149/1.3600718 info:cnr-pdr/source/autori:Fortunato, Guglielmo; Cuscunà, Massimo; Maiolo, Luca; Mariucci, Luigi; Rapisarda, Matteo; Pecora, Alessandro; Valletta, Antonio; Brotherton, Stan D./titolo:Short Channel effects and drain field relief architectures in polysilicon TFTs/doi:10.1149%2F1.3600718/rivista:ECS transactions/anno:2011/pagina_da:3/pagina_a:14/intervallo_pagine:3–14/volume:37 |
Popis: | Applications of polycrystalline silicon (polysilicon) thin film transistors (TFTs) to active matrix organic light emitting displays require further performance improvement. The biggest leverage in circuit performance can be obtained by reducing channel length from the typical current values of 3-6?m to 1?m, or less. However, short channel effects and hot-carrier induced instability in scaled down conventional self-aligned polysilicon TFTs can substantially degrade the device characteristics. To reduce these effects and allow proper operation of the circuits, drain field relief architectures have to be introduced. In this work we show that a fully self-aligned gate overlapped lightly doped drain (LDD) structure, with submicron LDD regions, can provide an excellent solution, allowing effective short channel effect control and improved electrical stability. ©The Electrochemical Society. |
Databáze: | OpenAIRE |
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