Design of packaging structures for high voltage power electronics devices: Electric field stress on insulation
| Autor: | Marie-Laure Locatelli, Helene Hourdequin, Pierre Bidan, Lionel Laudebat |
|---|---|
| Přispěvatelé: | LAboratoire PLasma et Conversion d'Energie (LAPLACE), Centre National de la Recherche Scientifique (CNRS)-Université Toulouse III - Paul Sabatier (UT3), Université Fédérale Toulouse Midi-Pyrénées-Université Fédérale Toulouse Midi-Pyrénées-Institut National Polytechnique (Toulouse) (Toulouse INP), Université Fédérale Toulouse Midi-Pyrénées, Matériaux Diélectriques dans la Conversion d’Energie (LAPLACE-MDCE), Université Fédérale Toulouse Midi-Pyrénées-Centre National de la Recherche Scientifique (CNRS)-Université Toulouse III - Paul Sabatier (UT3) |
| Rok vydání: | 2016 |
| Předmět: |
power module
Materials science finite element method 02 engineering and technology 01 natural sciences triple point chemistry.chemical_compound Power electronics Electric field 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Equipotential Silicon carbide Ceramic 010302 applied physics business.industry [SPI.NRJ]Engineering Sciences [physics]/Electric power 020208 electrical & electronic engineering Electrical engineering High voltage Finite element method [SPI.TRON]Engineering Sciences [physics]/Electronics chemistry Power module visual_art visual_art.visual_art_medium Optoelectronics metallized ceramic substrate business |
| Zdroj: | 2016 IEEE International Conference on Dielectrics (ICD) 2016 IEEE International Conference on Dielectrics (ICD), Jul 2016, Montpellier, France. pp.999-1002, ⟨10.1109/ICD.2016.7547786⟩ |
| DOI: | 10.1109/icd.2016.7547786 |
| Popis: | International audience; The use of very high voltage power modules (> 10 kV) requires the implementation of appropriate structures for the device packaging. Particularly the triple point between the insulating substrate, the metallization and the encapsulation is subjected to strong electric field stress. A novel architecture is proposed for the metallized ceramic substrate. Its interest is validated by using finite element method simulations to analyze the electric field distribution inside the module. It is shown that creating a gap between the top electrodes thus forming mesa structures, enables a significant spreading of the equipotential lines. The resulting maximum electric field decreases exponentially versus the height of the mesa structure, with better results than when simply increasing the thickness of the ceramic in a conventional module structure. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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