High Power, Thermally Efficient, X-band 3D T/R Module With Calibration Capability for Space Radar
| Autor: | Alessandro Di Carlofelice, Francesco de Paulis, Antonio Fina |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
Power-added efficiency
General Computer Science Computer science low temperature co-fired ceramics (LTCC) X band Gallium nitride 02 engineering and technology AESA Directivity Space-based radar GaN Gallium arsenide 3D packaging 3D multichip module (MCM) technology chemistry.chemical_compound Engineering (all) directional coupler PAE transmit/receive (T/R) module Computer Science (all) Materials Science (all) 0203 mechanical engineering 0202 electrical engineering electronic engineering information engineering General Materials Science Monolithic microwave integrated circuit 020301 aerospace & aeronautics business.industry General Engineering Electrical engineering 020206 networking & telecommunications chemistry Power dividers and directional couplers lcsh:Electrical engineering. Electronics. Nuclear engineering Antenna (radio) business lcsh:TK1-9971 |
| Zdroj: | IEEE Access, Vol 6, Pp 60921-60929 (2018) |
| ISSN: | 2169-3536 |
| DOI: | 10.1109/access.2018.2876011 |
| Popis: | Earth observation from space radar is based on the active electronically steerable antenna (AESA) whose performances count on reliable and powerful transmit/receive modules (TRM). To this aim, as a follow-up of the successful demonstration of a low-footprint transmit/receive hybrid module concept based on 3-D packaging and interconnect technologies (3DTRM), the interest for carrying out additional development work took a further step aiming at achieving a three-fold module performance improvement as well as at consolidating the novel proposed 3-D technology for space applications. First, the possibility of performing an AESA highly accurate calibration was implemented by embedding a wide band, high directivity directional coupler in the module circuitry without any total module footprint increase. Second, the heat extraction capability of the metal-ceramic hermetic package was enhanced through a re-design of the monolithic microwave integrated circuit (MMIC)-to-sink interface. And finally, the gallium arsenide (GaAs) MMIC high power amplifier (HPA) of the first 3DTRM version was replaced by a gallium nitride (GaN) HPA MMIC, obtaining both a higher transmit output power at 5 dB of compressed gain and an improved power added efficiency (PAE) at module level. |
| Databáze: | OpenAIRE |
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