Optimized Power Modules for Silicon Carbide MOSFET
| Autor: | Guillaume Regnat, Pierre-Olivier Jeannin, David Frey, Stefan Mollov, Jeffrey Ewanchuk, Jean-Paul Ferrieux |
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| Přispěvatelé: | Laboratoire de Génie Electrique de Grenoble (G2ELab), Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes [2016-2019] (UGA [2016-2019]), Mitsubishi Electric R&D Centre Europe [France] (MERCE-France), Mitsubishi Electric [France], Garcia, Sylvie |
| Jazyk: | angličtina |
| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Computer science business.industry 020208 electrical & electronic engineering [SPI.NRJ]Engineering Sciences [physics]/Electric power Electrical engineering 02 engineering and technology 7. Clean energy 01 natural sciences Inductance chemistry.chemical_compound chemistry Logic gate Power module 0103 physical sciences MOSFET 0202 electrical engineering electronic engineering information engineering Electronic engineering Silicon carbide RLC circuit Commutation Parasitic extraction business [SPI.NRJ] Engineering Sciences [physics]/Electric power |
| Zdroj: | IEEE Transactions on Industry Applications IEEE Transactions on Industry Applications, Institute of Electrical and Electronics Engineers, 2018, 54 (2), pp.1634--1644. ⟨10.1109/TIA.2017.2784802⟩ Energy Conversion Congress & Exposition (ECCE 2016) Energy Conversion Congress & Exposition (ECCE 2016), Sep 2016, Milwaukee, United States |
| ISSN: | 0093-9994 |
| DOI: | 10.1109/TIA.2017.2784802⟩ |
| Popis: | An Integrated Power Board technology was used to construct a 3D power module. This packaging is suitable for use of WBG devices as it reduces the inductive parasitics to the strict minimum, with a 2nH loop inductance in our 1.2kV/80A SiC prototype using SiC MOSFETs. The packaging presents virtually no parasitics or necessity for slowing down the commutation, which is oscillation-free. The conducted emissions of the 3D module are more than halved in comparison to those of a bespoke wire-bonded, EMI-optimised module. |
| Databáze: | OpenAIRE |
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