| Autor: |
Kappert, Holger, Braun, Sebastian, Kordas, Norbert, Kosfeld, Andre, Utz, Alexander, Weber, Constanze, Rämer, Olaf, Spanier, Malte, Ihle, Martin, Ziesche, Steffen, Kokozinski, Rainer |
| Přispěvatelé: |
Publica |
| Rok vydání: |
2022 |
| Předmět: |
|
| Zdroj: |
Journal of Microelectronics and Electronic Packaging. 19:1-7 |
| ISSN: |
1551-4897 |
| DOI: |
10.4071/imaps.1547377 |
| Popis: |
Sensors are the key elements for capturing environmental properties and are increasingly important in the industry for the intelligent control of industrial processes. While in many everyday objects highly integrated sensor systems are already state of the art, the situation in an industrial environment is clearly different. Frequently, the use of sensor systems is impossible, because the extreme ambient conditions of industrial processes like high operating temperatures or strong mechanical load do not allow the reliable operation of sensitive electronic components. Fraunhofer is running the Lighthouse Project “eHarsh” to overcome this hurdle. In the course of the project, an integrated sensor readout electronic has been realized based on a set of three chips. A dedicated sensor fron-tend provides the analog sensor interface for resistive sensors typically arranged in a Wheatstone configuration. Furthermore, the chipset includes a 32-bit microcontroller for signal conditioning and sensor control. Finally, it comprises an interface chip including a bus transceiver and voltage regulators. The chipset has been realized in a high-temperature 0.35-micron SOI-CMOS technology focusing operating temperatures up to 300°C. The chipset is assembled on a multilayer ceramic low-temperature cofired ceramics (LTCC) board using flip chip technology. The ceramic board consists of four layers with a total thickness of approximately 0.9 mm. The internal wiring is based on silver paste while the external contacts were alternatively manufactured in silver (sintering/soldering) or in gold alloys (wire bonding). As an interconnection technology, silver sintering has been applied. It has already been shown that a significant increase in lifetime can be reached by using silver sintering for die attach applications. Using silver sintering for flip chip technology is a new and challenging approach. By adjusting the process parameter geared to the chipset design and the design of the ceramic board high-quality flip chip interconnects can be generated. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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