Void-free bonding for a large slab laser crystal
Autor: | Jian Xu, Zuyan Xu, Baoshan Wang, Yan-Yong Lin, Chen Zhongzheng, Jialin Xu, Yong Bo, Ya-Ding Guo, Yiting Xu, Lei Yuan, Jun-Wei Zuo, Qinjun Peng, Hongwei Gao |
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Rok vydání: | 2020 |
Předmět: |
Wavefront
Materials science business.industry chemistry.chemical_element Solderability Heat sink Laser 01 natural sciences Atomic and Molecular Physics and Optics law.invention 010309 optics Crystal Interferometry Optics chemistry law 0103 physical sciences Slab Electrical and Electronic Engineering business Engineering (miscellaneous) Indium |
Zdroj: | Applied Optics. 59:459 |
ISSN: | 2155-3165 1559-128X |
DOI: | 10.1364/ao.59.000459 |
Popis: | A void-free bonding technique was demonstrated for a large slab Nd: YAG crystal with a bonding surface dimension of ∼ 160 m m × 70 m m . By using the novel fluxless oxide layer removal technology, the indium-oxide barrier problem was resolved. With the help of electrochemical-polished indium solder and a plasma-cleaned heat sink, the solderability of the indium was enhanced; in particular, the contact angle of the solder was improved from 51° to 31°. With the largest-bonding-size slab, a single-slab laser created a maximum output power of 7.3 kW under an absorbed pump power of 12.8 kW, corresponding to an optical to optical efficiency of 57% and a slope conversion of 67.8%. By detecting the wavefront of the interferometer before and after bonding, the RMS of wavefront was 0.192 λ and 0.434 λ ( λ = 633 n m ), respectively. To the best of our knowledge, this is the largest void-free bonding size for a laser slab and the highest output power achieved from a single-slab crystal laser oscillator. |
Databáze: | OpenAIRE |
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