High temperature ageing of microelectronics assemblies with SAC solder joints
| Autor: | Hervé Morel, Pierre Bondue, Wissam Sabbah, Alexandrine Guédon-Gracia, Hélène Fremont, Cyril Buttay, Oriol Avino-Salvado |
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| Přispěvatelé: | Ampère, Département Energie Electrique (EE), Ampère (AMPERE), École Centrale de Lyon (ECL), Université de Lyon-Université de Lyon-Université Claude Bernard Lyon 1 (UCBL), Université de Lyon-Institut National des Sciences Appliquées de Lyon (INSA Lyon), Université de Lyon-Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS)-Institut National de Recherche pour l’Agriculture, l’Alimentation et l’Environnement (INRAE)-École Centrale de Lyon (ECL), Université de Lyon-Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS)-Institut National de Recherche pour l’Agriculture, l’Alimentation et l’Environnement (INRAE), Laboratoire de l'intégration, du matériau au système (IMS), Centre National de la Recherche Scientifique (CNRS)-Institut Polytechnique de Bordeaux-Université Sciences et Technologies - Bordeaux 1, PIA (investissements d'avenir) GENOME PREMICES, Université Sciences et Technologies - Bordeaux 1-Institut Polytechnique de Bordeaux-Centre National de la Recherche Scientifique (CNRS) |
| Rok vydání: | 2017 |
| Předmět: |
Maximum temperature
Materials science business.industry 020208 electrical & electronic engineering Metallurgy Intermetallic Failure mechanism 02 engineering and technology 021001 nanoscience & nanotechnology Condensed Matter Physics Microstructure Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Ageing Soldering 0202 electrical engineering electronic engineering information engineering Microelectronics [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics Electrical and Electronic Engineering 0210 nano-technology Safety Risk Reliability and Quality business Electronic systems |
| Zdroj: | Microelectronics Reliability Microelectronics Reliability, Elsevier, 2017, ⟨10.1016/j.microrel.2017.06.065⟩ |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2017.06.065 |
| Popis: | International audience; In some applications, electronic systems are expected to operate at high ambient temperature (e.g. 150 °C). In this paper, we investigate the failure mechanism and microstructure evolution of solder-free (SAC) solder joints at a maximum temperature of 175 °C. It is found that no new failure mechanisms are triggered, and that ageing tests for solder can be accelerated at 175 °C. In particular, the growth rate of the interfacial intermetallic compound (IMC) is found to be consistent with that observed at lower temperatures. |
| Databáze: | OpenAIRE |
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