| Autor: |
Jonathan Simon, L.W. Mirkarimi, M. Nystrom, E. DeGroot, Chao-Kun Lin, W. Dyckman, Steven A. Rosenau, George A. Katopis, B.E. Lemoff, A. Grot, M.E. Ali, Daniel J. Stigliani, B. Law, G.M. Flower, M.R.T. Tan, Evan G. Colgan, Bruce K. Furman, Hui Xia, John H. Magerlein, R.W. Gruhlke, J. Torok, Dale Becker, Glenn H. Rankin, Jeremy D. Schaub, Ashish Tandon, D.W. Dolfi, L.A.B. Windover, K.D. Djordjev, Kirk S. Giboney, D. O'Connor |
| Předmět: |
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| Zdroj: |
Scopus-Elsevier |
| Popis: |
A novel packaging concept is demonstrated where parallel-optical subassemblies are mounted on the same substrate as processor chips for processor-to-processor communication within a high-end server. A single-channel bit-error ratio |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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