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This paper discusses the complexity of integration of dies from multiple semiconductor manufacturers in 3D stacks with each die providing different functionality, e.g., analog, digital, RF, etc. The authors show how an XMLbased infrastructure for data representation and sharing facilitates the efficient exchange of data, thus easing the challenges of 3D integration, due to the fact that XML is an open, well-known and widely-used standard language that is available on multiple computing platforms. |
