INFLUENCE OF COPPER VAPORS IN SF 6 PLASMA

Autor: Frank Reichert, A. Harry Solo, Pierre Freton, J.-J. Gonzalez, Arkadz Petchanka
Přispěvatelé: Arc Electrique et Procédés Plasmas Thermiques (LAPLACE-AEPPT), LAboratoire PLasma et Conversion d'Energie (LAPLACE), Centre National de la Recherche Scientifique (CNRS)-Université Toulouse III - Paul Sabatier (UT3), Université Fédérale Toulouse Midi-Pyrénées-Université Fédérale Toulouse Midi-Pyrénées-Institut National Polytechnique (Toulouse) (Toulouse INP), Université Fédérale Toulouse Midi-Pyrénées-Centre National de la Recherche Scientifique (CNRS)-Université Toulouse III - Paul Sabatier (UT3), Université Fédérale Toulouse Midi-Pyrénées, Siemens AG [Germany]
Jazyk: angličtina
Rok vydání: 2019
Předmět:
Zdroj: Plasma Physics and Technology XX
Plasma Physics and Technology XX, 2019, pp.1-4. ⟨10.14311/ppt.2019.2.161⟩
DOI: 10.14311/ppt.2019.2.161⟩
Popis: International audience; In this study a theoretical approach allows estimating the ablation mass flux of copper from a corrected Hertz-Knudsen flux. The influence of the copper vapours coming from the anode electrode to an SF 6 plasma is studied in a simplified 2D configuration. Depending on the plasma pressure an ablation or a diffusion state is considered. The amount of copper versus time is presented. An RMS current I=10kA is applied leading at t=10ms to an amount of copper equal to 0.6mg. The vapours change the plasma properties mainly the electrical conductivity and radiation and so the plasma behaviour. At time t=5ms the electrode erosion leads to a copper plasma. This simple case shows the necessity to well consider the copper erosion in plasma modelling as in High Voltage Circuit Breaker (HVCB) where higher current are considered.
Databáze: OpenAIRE