Modelization and characterization of 2D and 3D mid inductors for multidirectional inductive proximity sensing
| Autor: | Michel Cabrera, Sergkei Kamotesov, Mael Moguedet, Philippe Lombard, Amaury Veille, Rabah Dahmani, V. Semet, Christian Vollaire |
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| Přispěvatelé: | Ampère, Département Energie Electrique (EE), Ampère (AMPERE), École Centrale de Lyon (ECL), Université de Lyon-Université de Lyon-Université Claude Bernard Lyon 1 (UCBL), Université de Lyon-Institut National des Sciences Appliquées de Lyon (INSA Lyon), Université de Lyon-Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS)-Institut National de Recherche pour l’Agriculture, l’Alimentation et l’Environnement (INRAE)-École Centrale de Lyon (ECL), Université de Lyon-Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Centre National de la Recherche Scientifique (CNRS)-Institut National de Recherche pour l’Agriculture, l’Alimentation et l’Environnement (INRAE), Ampère, Département Méthodes pour l'Ingénierie des Systèmes (MIS), Smart plastic products (S2P) |
| Jazyk: | angličtina |
| Rok vydání: | 2016 |
| Předmět: |
Fabrication
Materials science Molded interconnect device impedance measurement inductors 02 engineering and technology Inductor 01 natural sciences law.invention law 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Eddy current 010306 general physics Electrical impedance Electrical conductor business.industry 020208 electrical & electronic engineering [SPI.NRJ]Engineering Sciences [physics]/Electric power Electrical engineering inductive sensing Inductance Q factor Optoelectronics proximity detection business Molded Interconnect Devices |
| Zdroj: | Proceedings of the12th International Congress Molded Interconnect Devices MID MID, Sep 2016, Würzburg, Germany. 7738936 (6 p.), ⟨10.1109/ICMID.2016.7738936⟩ |
| DOI: | 10.1109/ICMID.2016.7738936⟩ |
| Popis: | International audience; The modelization, fabrication and characterization of inductors using Molded Interconnect Device technology for multidirectional inductive proximity sensing is reported. Inductive proximity sensing allows contactless measurement of the position of electrically conductive objects. The principle of measurement relies on the use of an inductor which impedance is modified by the induced eddy currents at the surface of the conductive object. Inductors on LCP polymer are fabricated with MID technology, electroless metallization and electrodeposition of copper. 2D inductors are fabricated and characterized. Key parameter values are analyzed with a simplified model. Then proof of concept for 3D proximity sensing with a MID device is demonstrated. |
| Databáze: | OpenAIRE |
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