Dynamical growth behavior of copper clusters during electrodeposition
| Autor: | Jae-mock Yi, Yong S. Chu, Giorgio Margaritondo, Syue-Ren Wu, Yeukuang Hwu, Pei-Cheng Hsu, Cheng-Liang Wang |
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| Předmět: |
Materials science
Physics and Astronomy (miscellaneous) chemistry.chemical_element Electrochemical Nucleation CIBM-PC law.invention Overlayer Barrier Layers Electrolytes law Microscopy Cluster (physics) surface morphology X-ray microscopy Au(111) Deposition Deposition (law) Cu Films particle size Copper Scanning-Tunneling-Microscopy Crystallography metal clusters chemistry Chemical physics copper electrodeposition Particle size Crystallite Gold Scanning tunneling microscope Au(100) |
| Popis: | Ultrahigh resolution full-field transmission x-ray microscopy enabled us to observe detailed phenomena during the potentiostatic copper electrodeposition on polycrystalline gold. We detected two coexisting cluster populations with different sizes. Their growth behaviors are different, with a shape transitions only occurring for large clusters. These differences influence the micromorphology and general properties of the overlayer. (C) 2010 American Institute of Physics. [doi: 10.1063/1.3464550] |
| Databáze: | OpenAIRE |
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