Reducing environmentally induced defects while maintaining productivity
| Autor: | Javier Ayala, W. Steer, S. Conti, K. Tabakman, Richard O. Henry, Chienfan Yu, E. Meyette, R. Arndt, J. Levy, R. Burda, R. Keyser, R. Van Roijen, Jeffery B. Maxson |
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| Rok vydání: | 2011 |
| Předmět: |
Engineering
business.industry Semiconductor device fabrication Process (engineering) Workaround Condensed Matter Physics Maintenance engineering Industrial and Manufacturing Engineering Manufacturing engineering Electronic Optical and Magnetic Materials Cycle time Risk analysis (engineering) Electronic engineering Queue time Node (circuits) Electrical and Electronic Engineering business Productivity |
| Zdroj: | 2011 IEEE/SEMI Advanced Semiconductor Manufacturing Conference. |
| DOI: | 10.1109/asmc.2011.5898199 |
| Popis: | In semiconductor manufacturing, we expect the cause of defects to be process or tool related. However, at the 90 nm technology node and beyond we find that defects can be caused by issues related to the wafers' environment, such as processing of other wafers in the same tool or in the same carrier, or by seemingly innocuous actions. We pay special attention to the role of the mini-environment, which is deemed essential to achieving low particle counts for advanced technology nodes. We show defects that are caused by the environment, and some which are specifically related to the use of the mini-environment. We discuss several ways to reduce the sensitivity to environmental factors. Process and tool changes are found that eliminate yield detractors. We also present a workaround that has helped reduce the impact of queue time restrictions on cycle time. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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