Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength
| Autor: | Abdulaziz N. Alhazaa, Anas M. Atieh, Wael Al-Kouz, Michael Weser, Tala J Abedalaziz, Ma’en S. Sari, Ibrahim Alhoweml |
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| Jazyk: | angličtina |
| Rok vydání: | 2019 |
| Předmět: |
010302 applied physics
Materials science reflow soldering General Chemical Engineering Solder paste Nanoparticle 02 engineering and technology 021001 nanoscience & nanotechnology Microstructure 01 natural sciences Article nanocomposite solders paste lcsh:Chemistry Reflow soldering solder reliability Electrical resistance and conductance lcsh:QD1-999 Soldering 0103 physical sciences Nano General Materials Science Particle size Composite material 0210 nano-technology soldering CT scan |
| Zdroj: | Nanomaterials Volume 9 Issue 10 Nanomaterials, Vol 9, Iss 10, p 1478 (2019) |
| ISSN: | 2079-4991 |
| DOI: | 10.3390/nano9101478 |
| Popis: | In this study, the effects of adding Sn nanopowder (particle size < 150 nm) to three solder pastes SAC3-X(H)F3+, SCAN-Ge071-XF3+, and water washable WW50-SAC3 are evaluated regarding microstructure, morphology, joint strength, and electrical resistance. The nanopowder was added at a rate of 10% by weight and then mechanically mixed until homogenous solder paste was obtained. The results showed that the addition of Sn nanoparticles resulted in homogenous bond formation for SAC-3 and SCAN, while voids and bubbles formation slightly increased within the joint interface for the water washable solder paste. The SCAN + Sn nano reinforced solder paste showed increased variation of joint strength from 12.6 to 39.9 N, while the water washable + Sn nanopowder reinforced solder paste showed less variability in joint strength from 17.3 to 33.9 N. Both sets of solder paste with and without Sn nano reinforced solder paste showed a reliable quality joint under mechanical shock testing after six shocks in six milliseconds with an 87.1 ms pulse duration. The results showed that Sn nanoparticles resulted in a small resistance change, while RDC values (in m&Omega ) slightly decreased for SAC and increased for SCAN and further increases for water washable solder paste. |
| Databáze: | OpenAIRE |
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