TEM and HREM of diamond crystals grown on Si tips: structure and results of ion-beam-treatment
Autor: | L. L. Aksenova, E. S. Mashkova, E. V. Rakova, V. A. Molchanov, N.A. Kiselev, V. V. Roddatis, E.I. Givargizov, John L. Hutchison, A.N. Stepanova |
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Jazyk: | angličtina |
Rok vydání: | 2016 |
Předmět: |
Materials science
Ion beam Silicon Material properties of diamond General Physics and Astronomy chemistry.chemical_element Diamond Nanotechnology Cell Biology Chemical vapor deposition engineering.material Amorphous solid Nanoclusters chemistry Structural Biology engineering General Materials Science Composite material High-resolution transmission electron microscopy |
Zdroj: | Micron |
Popis: | Diamond single crystals were grown on the silicon whiskers by a hot filament chemical vapor deposition technique at the filament temperature about 2100degreesC and the temperature of support 800degreesC. Specimens were examined by SEM, TEM, HRTEM and SAED. When the filament temperature was about 1900degreesC globular polycrystalline diamond particles were grown. At a support temperature more then 800degreesC SiC nanoparticles were formed. To investigate the ion etching process of the silicon tip/diamond system. tips were treated with an Ar+ beam with energy up to 30 kV. The results depend on fluence: at 4 X 10(18) ion/cm(2) diamonds and partially Si tips were destroyed, amorphous layer was formed (sometimes with nanometric size fragments of diamond); at 1 X 10(18) ion/cm(2) sharpened diamonds (radius of curvature about 20 nm) covered with amorphous layer (radius about 80 nm) probably with nanoclusters of diamond were observed; at 4.4 X 10(17) ion/cm(2) there was no visible tip sharpening but formation of amorphous thick layer occurred. The emission characteristics of Si tips covered with diamond were improved due to ion treatment. Since such tips in our case were covered with amorphous layer containing nanometric size fragments of diamond, we suppose this layer is responsible for electron emission improvement. (C) 2004 Elsevier Ltd. All rights reserved. |
Databáze: | OpenAIRE |
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