Stable shape for copper film using low-temperature thermal decomposition of copper microparticles for printable electronics
| Autor: | Ji Ha Lee, Akihiro Yabuki, Yuta Iwamura, Indra Wahyudhin Fathona |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2020 |
| Předmět: |
Materials science
Formic acid General Physics and Astronomy chemistry.chemical_element Volume resistivity 02 engineering and technology 010402 general chemistry 01 natural sciences law.invention Copper particle chemistry.chemical_compound Optical microscope Electrical resistivity and conductivity law Calcination Physical and Theoretical Chemistry Microparticle Copper formate Thermal decomposition Printable electronics 021001 nanoscience & nanotechnology Copper 0104 chemical sciences Chemical engineering Volume (thermodynamics) chemistry 0210 nano-technology |
| Popis: | A paste of copper microparticles, formic acid, and octylamine was developed to produce thick copper films with a stable shape and low electrical resistivity via low-temperature calcination. This study examined (1) the effect of cleaning the copper microparticle surface with formic acid, (2) the effect of calcination temperature, and (3) the effect that the addition of amine exerted on volume resistivity and on the shape of the copper film. The volume resistivities of the thick copper film were measured using a 4-point probe method. The thickness and shape of the copper film was observed via FE-SEM using an optical microscope. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|