Mechanical Durability of Flexible Printed Circuit Boards Containing Thin Coverlays Fabricated with Poly(Amide-Imide-Urethane)/Epoxy Interpenetrating Networks
| Autor: | Myong Jae Yoo, Chan-Jae Lee, Jeongah Kim, Youngmin Kim, Seong Dae Park, Bo-Young Kim, Ji Hun Seo |
|---|---|
| Jazyk: | angličtina |
| Rok vydání: | 2021 |
| Předmět: |
Materials science
Mechanical Engineering Epoxy Article Flexible electronics coverlay chemistry.chemical_compound chemistry Control and Systems Engineering flexible printed circuit boards visual_art Polyamide TJ1-1570 visual_art.visual_art_medium Thermal stability MIT folding test Mechanical engineering and machinery Adhesive Electrical and Electronic Engineering Composite material interpenetrating network Curing (chemistry) Polyimide poly(amide-imide-urethane) Polyurethane |
| Zdroj: | Micromachines Volume 12 Issue 8 Micromachines, Vol 12, Iss 943, p 943 (2021) |
| ISSN: | 2072-666X |
| DOI: | 10.3390/mi12080943 |
| Popis: | Because electronics are becoming flexible, the demand for techniques to manufacture thin flexible printed circuit boards (FPCBs) has increased. Conventional FPCBs are fabricated by attaching a coverlay film (41 μm) onto copper patterns/polyimide (PI) film to produce the structure of coverlay/Cu patterns/PI film. Given that the conventional coverlay consists of two layers of polyimide film and adhesive, its thickness must be reduced to generate thinner FPCBs. In this study, we fabricated 25-μm-thick poly(amide-imide-urethane)/epoxy interpenetrating networks (IPNs) to replace the thick conventional coverlay. Poly(amide-imide-urethane) (PAIU) was synthesized by reacting isocyanate-capped polyurethane with trimellitic anhydride and then mixed with epoxy resin to produce PAIU/epoxy IPNs after curing. Thanks to the soft segments of polyurethane, the elongation of PAIU/epoxy IPNs increased with increasing PAIU content and reached over 200%. After confirming the excellent thermal stability and chemical resistance of the PAIU/epoxy IPNs, we fabricated FPCBs by equipping them as coverlays. The mechanical durability of the FPCBs was evaluated through an MIT folding test, and the FPCB fabricated with PAIU/ep-2 was stable up to 164 folding cycles because of the balanced mechanical properties. |
| Databáze: | OpenAIRE |
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