Test Beam Results of 3D Silicon Pixel Sensors for the ATLAS upgrade
| Autor: | ATLAS 3D Collaboration, Grenier, P., Alimonti, G., Barbero, M., Bates, R., Bolle, E., Borri, M., Boscardin, M., Buttar, C., Capua, M., Cavalli-Sforza, M., Cobal, M., Cristofoli, A., Betta, G-F. Dalla, Darbo, G., Da Vi��, C., Devetak, E., DeWilde, B., Di Girolamo, B., Dobos, D., Einsweiler, K., Esseni, D., Fazio, S., Fleta, C., Freestone, J., Gallrapp, C., Garcia-Sciveres, M., Gariano, G., Gemme, C., Giordani, M-P., Gjersdal, H., Grinstein, S., Hansen, T., Hansen, T-E., Hansson, P., Hasi, J., Helle, K., Hoeferkamp, M., H��gging, F., Jackson, P., Jakobs, K., Kalliopuska, J., Karagounis, M., Kenney, C., K��hler, M., Kocian, M., Kok, A., Kolya, S., Korokolov, I., Kostyukhin, V., Kr��ger, H., La Rosa, A., Lai, C. H., Lietaer, N., Lozano, M., Mastroberardino, A., Micelli, A., Nellist, C., Oja, A., Oshea, V., Padilla, C., Palestri, P., Parker, S., Parzefall, U., Pater, J., Pellegrini, G., Pernegger, H., Piemonte, C., Pospisil, S., Povoli, M., Roe, S., Rohne, O., Ronchin, S., Rovani, A., Ruscino, E., Sandaker, H., Seidel, S., Selmi, L., Silverstein, D., Sj��b��k, K., Slavicek, T., Stapnes, S., Stugu, B., Stupak, J., Su, D., Susinno, G., Thompson, R., Tsung, J-W., Tsybychev, D., Watts, S. J., Wermes, N., Young, C., Zorzi, N. |
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| Jazyk: | angličtina |
| Rok vydání: | 2011 |
| Předmět: |
Nuclear and High Energy Physics
Physics - Instrumentation and Detectors Physics::Instrumentation and Detectors FOS: Physical sciences Solenoid 01 natural sciences Radiation hard detectors Particle detector Charge sharing Silicon sensors Optics Nuclear magnetic resonance Atlas (anatomy) 0103 physical sciences medicine ATLAS upgrade Detectors and Experimental Techniques 010306 general physics Instrumentation Physics Large Hadron Collider Pixel 010308 nuclear & particles physics business.industry Detector 3D sensors Instrumentation and Detectors (physics.ins-det) Semiconductor detector medicine.anatomical_structure business |
| Zdroj: | Grenier, P, Alimonti, G, Barbero, M, Bates, R, Bolle, E, Borri, M, Boscardin, M, Buttar, C, Capua, M, Cavalli-Sforza, M, Cobal, M, Cristofoli, A, Dalla Betta, G F, Darbo, G, Da Vià, C, Devetak, E, Dewilde, B, Di Girolamo, B, Dobos, D, Einsweiler, K, Esseni, D, Fazio, S, Fleta, C, Freestone, J, Gallrapp, C, Garcia-Sciveres, M, Gariano, G, Gemme, C, Giordani, M P, Gjersdal, H, Grinstein, S, Hansen, T, Hansen, T E, Hansson, P, Hasi, J, Helle, K, Hoeferkamp, M, Hügging, F, Jackson, P, Jakobs, K, Kalliopuska, J, Karagounis, M, Kenney, C, Köhler, M, Kocian, M, Kok, A, Kolya, S, Korokolov, I, Kostyukhin, V, Krüger, H, La Rosa, A, Lai, C H, Lietaer, N, Lozano, M, Mastroberardino, A, Micelli, A, Nellist, C, Oja, A, Oshea, V, Padilla, C, Palestri, P, Parker, S, Parzefall, U, Pater, J, Pellegrini, G, Pernegger, H, Piemonte, C, Pospisil, S, Povoli, M, Roe, S, Rohne, O, Ronchin, S, Rovani, A, Ruscino, E, Sandaker, H, Seidel, S, Selmi, L, Silverstein, D, Sjøbæk, K, Slavicek, T, Stapnes, S, Stugu, B, Stupak, J, Su, D, Susinno, G, Thompson, R, Tsung, J W, Tsybychev, D, Watts, S J, Wermes, N, Young, C & Zorzi, N 2011, ' Test beam results of 3D silicon pixel sensors for the ATLAS upgrade ', Nuclear Instruments and Methods in Physics Research. Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, vol. 638, no. 1, pp. 33-40 . https://doi.org/10.1016/j.nima.2011.01.181 |
| Popis: | Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS Inner Detector solenoid field. Sensors were bump bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance. Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable-B-Layer and High Luminosity LHC (HL-LHC)) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS Inner Detector solenoid field. Sensors were bump bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance. |
| Databáze: | OpenAIRE |
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