Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films
| Autor: | D. Mangelinck, Dongzhi Chi, D. J. Srolovitz, H. B. Yao, M. Bouville, X. Q. Pan, H. P. Sun |
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| Rok vydání: | 2006 |
| Předmět: |
Condensed Matter - Materials Science
Materials science Economies of agglomeration General Chemical Engineering chemistry.chemical_element Materials Science (cond-mat.mtrl-sci) FOS: Physical sciences Germanium Stress (mechanics) Germanide Nickel chemistry.chemical_compound chemistry Electrochemistry General Materials Science Grain boundary Electrical and Electronic Engineering Physical and Theoretical Chemistry Thin film Composite material Groove (engineering) |
| DOI: | 10.48550/arxiv.cond-mat/0605451 |
| Popis: | Germanosilicides, especially those formed on compressive substrates, are less stable than silicides against agglomeration. By studying the solid-state reaction of Ni thin film on strained Si0.8Ge0.2(001), we show that nickel germanosilicide is different from nickel silicide and nickel germanide in several respects: the grains are smaller and faceted, the groove angle is sharper, and dealloying takes place. The germanium out-diffusion creates a stress in the film which favors grooving and agglomeration. Comment: 13 pages, 4 figures |
| Databáze: | OpenAIRE |
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