SPICE Level 3 and BSIM3v3.1 characterization of monolithic integrated CMOS-MEMS devices
| Autor: | F. W. Hewlett, James H. Smith, Bevan D. Staple, H. A. Watts, A. P. Griego, Christopher W. Dyck |
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| Rok vydání: | 1998 |
| Předmět: |
Microelectromechanical systems
business.industry Computer science Transconductance Transistor Integrated circuit Propagation delay Ring oscillator Capacitance law.invention CMOS Hardware_GENERAL law MOSFET Miniaturization Electronic engineering Microelectronics Field-effect transistor Electronics business Cmos process Voltage |
| Zdroj: | SPIE Proceedings. |
| ISSN: | 0277-786X |
| Popis: | Thy monolithic integration of MicroElectroMechanical Systems (MEMS) with the driving, controlling, and signal processing electronics promises to improve the performance of micromechanical devices as well as lower their manufacturing, packaging, and instrumentation costs. Key to this integration is the proper interleaving, combining, and customizing of the manufacturing processes to produce functional integrated micromechanical devices with electronics. We have developed a MEMS-first monolithic integrated process that first seals the micromechanical devices in a planarized trench and then builds the electronics in a conventional CMOS process. To date, most of the research published on this technology has focused on the performance characteristics of the mechanical portion of the devices, with little information on the attributes of the accompanying electronics. This work attempts to reduce this information void by presenting the results of SPICE Level 3 and BSIM3v3.1 model parameters extracted for the CMOS portion of the MEMS-first process. Transistor-level simulations of MOSFET current, capacitance, output resistance, and transconductance versus voltage using the extracted model parameters closely match the measured data. Moreover, in model validation efforts, circuit-level simulation values for the average gate propagation delay in a 101-stage ring oscillator are within 13 - 18% of the measured data. These results establish the following: (1) the MEMS-first approach produces functional CMOS devices integrated on a single chip with MEMS devices and (2) the devices manufactured in the approach have excellent transistor characteristics. Thus, the MEMS-first approach renders a solid technology foundation for customers designing in the technology. |
| Databáze: | OpenAIRE |
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