SOI-based, High Reliable Pressure Sensor with Floating Concept for High Temperature Applications
| Autor: | Andrea Giuliani, Biswaijit Mukhopadhyay, Lionello Drera, Domenico Arancio, Ha-Duong Ngo |
|---|---|
| Rok vydání: | 2014 |
| Předmět: |
melt pressure
Materials science Silicon on insulator Engraving EN 13849-1 sensor fluid free sensor Deflection (engineering) Thermal Electronic engineering Deep reactive-ion etching pressure sensor high temperature sensor Engineering(all) plastixc estrusion business.industry harsh environment General Medicine Chip Pressure sensor Piezoresistive effect SOI sensor visual_art visual_art.visual_art_medium Optoelectronics business plastic molding |
| Zdroj: | Procedia Engineering. 87:720-723 |
| ISSN: | 1877-7058 |
| DOI: | 10.1016/j.proeng.2014.11.639 |
| Popis: | In this paper we present a high reliable, accurate and safe, solid state pressure sensor for high temperature applications. The sensor is based on an unique fluid-free technology using a piezoresistive SOI-based chip enclosed in a sealed metal housing. The proprietary housing concept allows a complete separation of the SOI-chip from the measured media. A thick steel membrane and an elongated member (push-rod) transfer the outside pressure into a small deflection of a silicon membrane on the SOI-chip. The thin silicon membrane is engraved by DRIE (Deep Reactive Ion Etching). The sensor is capable to measure pressures up to 1000 bar at temperature up to 400 °C with an accuracy of ±0,50%FSO. A digital correction enables a compensation of Offset and Sensitivity thermal drifts. The sensor can undergo long-term extreme working conditions without losing its performances. |
| Databáze: | OpenAIRE |
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