Effect of Metal Powder Packing on the Conductivity of Nanometal Ink
| Autor: | Sun Mee Kang, Stephen M. Woessner, Anthony K. Amert, Namsoo Kim, Shawn Decker, Kenneth N. Han |
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| Rok vydání: | 2007 |
| Předmět: |
Materials science
Macromolecular Substances Surface Properties Molecular Conformation Biomedical Engineering chemistry.chemical_element Bioengineering Conductivity Metal Electrical resistivity and conductivity Materials Testing Conductive ink Nanotechnology General Materials Science Particle Size Composite material Inkwell Electric Conductivity General Chemistry Condensed Matter Physics Copper Nanostructures chemistry Metals visual_art visual_art.visual_art_medium Printing Metal powder Ink Particle size Powders Crystallization |
| Zdroj: | Journal of Nanoscience and Nanotechnology. 7:3902-3905 |
| ISSN: | 1533-4880 |
| DOI: | 10.1166/jnn.2007.071 |
| Popis: | The power of nanotechnology is realized in its application in numerous areas. One such area is undoubtedly the use of metallic nanoparticles as a direct write application. An effort in this area has resulted in a conductive ink whose conductivity approaches 60–70%that of the bulk copper. Such an ink has been developed by reducing silver, gold, and copper nano-sized powders by a wet method and followed by a heat treatment at less than 400 °C. The conductivity of the resulting ink product was found to be very much affected by how various sizes of metal powders are packed when particles were dried and packed on various substrates. The effect of packing and various kinds of metal powders on the eventual conductivity of the final product of the ink has been described and discussed in this paper. |
| Databáze: | OpenAIRE |
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