Dynamic cure and diffusion monitoring in thin encapsulant films
| Autor: | David R. Day, David D. Shepard |
|---|---|
| Rok vydání: | 2003 |
| Předmět: |
Permittivity
Materials science Photoresistor Epoxy Dielectric Conductivity Fick's laws of diffusion law.invention Differential scanning calorimetry law visual_art visual_art.visual_art_medium Dielectric loss sense organs Thin film Diffusion (business) Composite material Glass transition Curing (chemistry) |
| Zdroj: | 38th Electronics Components Conference 1988., Proceedings.. |
| DOI: | 10.1109/ecc.1988.12632 |
| Popis: | Recent developments in the area of microelectronics now enable the fabrication of microdielectric sensors that can follow the drying, curing, and diffusion phenomena in thin films. This paper first investigates the response of the rricrodielectric sensor to cure in a thin epoxy film. The multi-frequency loss factor data are reduced to a single “ion-viscosity” response curve representative of the change in ion mobility during the cure reaction. The dynanic dielectric data are compared to Tg as a function of time as determined by differential scanning calorimetry (DSC) on several partially cured samples. The dielectric response is shown to be extremely sensitive to the entire cure process. A similar epoxy film is exposed to alternately wet and dry environments while the dielectric response is monitored. The diffusion coefficient of water in the cured resin is estimated through the dynamic change in permittivity using a simple Fickian model and the results are shown to be in good agreement with the literature values. Finally, changes in dielectric properties of a photoresist during UV exposure are presented. |
| Databáze: | OpenAIRE |
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