On the evolution of microstructure and fracture behavior of multilayered copper sheet fabricated by accumulative roll bonding
| Autor: | Nokeun Park, Hamidreza Jafarian, A. Shojaei, M.T. Salehi, Ali Reza Eivani |
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| Rok vydání: | 2021 |
| Předmět: |
lcsh:TN1-997
Void (astronomy) Materials science Annealing (metallurgy) 02 engineering and technology 01 natural sciences Biomaterials Accumulative roll bonding 0103 physical sciences Ultimate tensile strength Composite material Microstructure lcsh:Mining engineering. Metallurgy 010302 applied physics Multi-layer Metals and Alloys 021001 nanoscience & nanotechnology Grain size Surfaces Coatings and Films Grain growth Electrical resistance Ceramics and Composites Strength 0210 nano-technology Copper Necking |
| Zdroj: | Journal of Materials Research and Technology, Vol 10, Iss, Pp 291-305 (2021) |
| ISSN: | 2238-7854 |
| DOI: | 10.1016/j.jmrt.2020.12.011 |
| Popis: | In this investigation, multi-layer copper sheets are fabricated using accumulative roll bonding (ARB). Evolution of microstructure and dislocation density during ARB and after that during annealing treatment at 500 °C are investigated. In addition, the evolution of voids at the interfaces between stacking layers which may cause delamination and premature fracture are statistically analyzed. It is found that the grain structure, dislocation density, size and volume fraction of voids can affect tensile properties and electrical resistivity. The average grain size in annealed multilayered copper sheets depends on the imposed strain during deformation, but as well, the thickness of the stacking layers which can control grain growth. A fraction of the interface is left out with no solid metallurgical bonding and form voids. The average void size reduces with further deformation. However, the surface fraction and number density of the voids increase which is due to the greater number of interfaces in line with larger number of stacking layers. With 2 cycles of ARB, the ultimate tensile strength of the samples increases significantly and the ductility reduces. However, with further deformation, ductility improves due to the reduction in dislocation density. After annealing, the ductility exceeds its initial values which is attributed to swarm necking resistance of many stacking layers in the multi-layer product. The specific electrical resistivity (SER) of the annealed multi-layer sheets would not equal the initially annealed sample which is due to the finer grain structure and the interfaces between stacking layers. |
| Databáze: | OpenAIRE |
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