Review of microstructure and properties of low temperature lead-free solder in electronic packaging
| Autor: | Lei Zhang, Li-li Gao, Nan Jiang, Liang Zhang, Su-juan Zhong, Kai-kai Xu |
|---|---|
| Rok vydání: | 2020 |
| Předmět: |
oxidation resistance
Materials science microstructure Electronic packaging 308 Materials resources / recycling wettability Nanoparticle Review 02 engineering and technology mechanical properties 010402 general chemistry 01 natural sciences Lead (geology) low temperature solder General Materials Science Aerospace Materials of engineering and construction. Mechanics of materials Oxidation resistance 103 Composites business.industry Metallurgy 503 TEM Optical Magnetic and Electronic Device Materials STEM 021001 nanoscience & nanotechnology Microstructure 0104 chemical sciences Soldering SEM TA401-492 Wetting 0210 nano-technology business TP248.13-248.65 Biotechnology |
| Zdroj: | Science and Technology of Advanced Materials, Vol 21, Iss 1, Pp 689-711 (2020) Science and Technology of Advanced Materials article-version (VoR) Version of Record |
| ISSN: | 1878-5514 1468-6996 |
| DOI: | 10.1080/14686996.2020.1824255 |
| Popis: | Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and through-hole technology assemblies in IBM mainframe due to its unique low temperature characteristics. The review evaluates the effects of alloying elements, rare earth elements and nanoparticles on the wettability, microstructure, mechanical properties and oxidation resistance of the low-temperature solders. |
| Databáze: | OpenAIRE |
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