High Speed Electrical Characterization And Simulation Of A Pin Grid Array Package
| Autor: | A.T. Murphy, Yoshikazu Murakami, Hiroyuki Fujita, Thomas W. Goodman |
|---|---|
| Rok vydání: | 2005 |
| Předmět: |
Frequency response
Signal processing Materials science Computer simulation business.industry Acoustics General Engineering Electrical engineering Electronic packaging Signal Dual in-line package Characterization (materials science) Condensed Matter::Superconductivity Frequency domain visual_art Pin grid array Electronic engineering visual_art.visual_art_medium Equivalent circuit Integrated circuit packaging Ceramic business Degradation (telecommunications) |
| Zdroj: | Proceedings of Japan International Electronic Manufacturing Technology Symposium. |
| DOI: | 10.1109/iemt.1993.639776 |
| Popis: | A 181 pin Pin Grid Array (PGA) was characterized using time and frequency domain techniques to identify major sources of signal degradation. The pins, as well as a layer of plating lines that was included for electroplating the exterior metal surfaces, were found to have a deleterious effect on the signal transmission within the package. In addition, a ground delay resulting from the separation of the signal pin and its nearest ground pin was seen to cause significant degradation in signal lines whose pin was far from a ground I/O. For signal lines that are geometrically equivalent due to package symmetry, this effect was seen to increase with increasing signal/nearest ground pin distance, resulting in as much as a 79% increase in the package risetime in some lines. These effects were simulated using a model whose elements were based on actual physical structures, within the package and whose parameters were derived from experimental measurements. > |
| Databáze: | OpenAIRE |
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