Experimental and numerical results correlation during extreme use of power MOSFET designed for avalanche functional mode
| Autor: | Richard Lallemand, Jean-Louis Blanchard, Jean-Michel Morelle, Gérard Coquery, Blaise Rouleau, Gael Blondel, Laurent Dupont |
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| Přispěvatelé: | Laboratoire des Technologies Nouvelles (INRETS/LTN), Institut National de Recherche sur les Transports et leur Sécurité (INRETS), Valeo CEE, VALEO, VALEO CEE, VALEO VES R&D Département |
| Rok vydání: | 2010 |
| Předmět: |
Engineering
Conduction mode business.industry Condensed Matter Physics Chip Temperature measurement TRANSISTOR Atomic and Molecular Physics and Optics Finite element method [SPI.TRON]Engineering Sciences [physics]/Electronics Computer Science::Other Surfaces Coatings and Films Electronic Optical and Magnetic Materials COMBUSTION Soldering MOSFET Electronic engineering PUISSANCE Electrical and Electronic Engineering Power MOSFET Safety Risk Reliability and Quality Hybrid vehicle business TEMPERATURE VEHICULE HYBRIDE |
| Zdroj: | Microelectronics Reliability Microelectronics Reliability, Elsevier, 2010, 50 (9-11), pp 1804-1809. ⟨10.1016/j.microrel.2010.07.127⟩ |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2010.07.127 |
| Popis: | Cost, weight and size reduction constrained designers of power electronic for micro hybrid vehicle to use power MOSFET under extreme conditions like avalanche mode. This paper shows the influence of the solder voids onto the die temperature distribution of a specifically designed power MOSFET. In the first part of this paper, a methodology is presented to perform fast dynamic temperature measurements during MOSFET avalanche (400 A–80 μs). In the second part of the paper, a comparison between experimental results and finite elements electro-thermal simulation is shown for power MOSFET operating in high conduction mode (500 A–100 ms). Finally the correlated numerical model is used to evaluate the sensitivity to solder voids of the chip temperature distribution. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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