Packaging and modular assembly of large-area and fine-pitch 2-D ultrasonic transducer arrays
| Autor: | Robert Gideon Wodnicki, Rayette Ann Fisher, B. Bonitz, B. Otto, Xuefeng Zhuang, Pierre Khuri-Yakub, M. Topper, O. Ehrmann, T. Fritzsch, Kai Erik Thomenius, William Edward Burdick, Der-Song Lin, David M. Mills, Charles Gerard Woychik, T. Davies, A. J. Byun, G. Thomas |
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| Přispěvatelé: | Publica |
| Rok vydání: | 2013 |
| Předmět: |
Engineering
Acoustics and Ultrasonics Phantoms Imaging business.industry Capacitive sensing Transducers Equipment Design Integrated circuit law.invention Capacitive micromachined ultrasonic transducers Transducer Application-specific integrated circuit law Ball grid array Interposer Electronic engineering Optoelectronics Integrated circuit packaging Electrical and Electronic Engineering business Instrumentation Ultrasonography |
| Zdroj: | IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control. 60:1356-1375 |
| ISSN: | 1525-8955 0885-3010 |
| Popis: | A promising transducer architecture for largearea arrays employs 2-D capacitive micromachined ultrasound transducer (CMUT) devices with backside trench-frame pillar interconnects. Reconfigurable array (RA) application-specified integrated circuits (ASICs) can provide efficient interfacing between these high-element-count transducer arrays and standard ultrasound systems. Standard electronic assembly techniques such as flip-chip and ball grid array (BGA) attachment, along with organic laminate substrate carriers, can be leveraged to create large-area arrays composed of tiled modules of CMUT chips and interface ASICs. A large-scale, fully populated and integrated 2-D CMUT array with 32 by 192 elements was developed and demonstrates the feasibility of these techniques to yield future large-area arrays. This study demonstrates a flexible and reliable integration approach by successfully combining a simple under-bump metallization (UBM) process and a stacked CMUT/interposer/ ASIC module architecture. The results show high shear strength of the UBM (26.5 g for 70-¿m balls), high interconnect yield, and excellent CMUT resonance uniformity (s = 0.02 MHz). A multi-row linear array was constructed using the new CMUT/interposer/ASIC process using acoustically active trench-frame CMUT devices and mechanical/ nonfunctional Si backside ASICs. Imaging results with the completed probe assembly demonstrate a functioning device based on the modular assembly architecture. |
| Databáze: | OpenAIRE |
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