Low-Temperature Plasma Modification of Styrene–Butadiene Block Copolymer Surfaces for Improved Adhesion—A Kinetic Approach
Autor: | Iwona Krawczyk-Kłys, Jacek Tyczkowski, Jan Sielski, Hanna Kierzkowska-Pawlak |
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Jazyk: | angličtina |
Rok vydání: | 2020 |
Předmět: |
Materials science
Styrene-butadiene Polymers and Plastics Adhesive bonding Kinetics Ionic bonding 02 engineering and technology Surface finish 010402 general chemistry 01 natural sciences Article lcsh:QD241-441 chemistry.chemical_compound oxygen functional groups lcsh:Organic chemistry Copolymer roughness General Chemistry Plasma Adhesion 021001 nanoscience & nanotechnology 0104 chemical sciences adhesion Chemical engineering chemistry kinetics peel test 0210 nano-technology plasma surface modification SBS copolymer |
Zdroj: | Polymers Volume 12 Issue 4 Polymers, Vol 12, Iss 935, p 935 (2020) |
ISSN: | 2073-4360 |
DOI: | 10.3390/polym12040935 |
Popis: | This paper proposed a kinetic model that can describe the changes in the adhesion properties of styrene&ndash butadiene (SBS) block copolymer surfaces under the influence of low-temperature plasma treatment. As a measure of these changes, the peel strength of joints formed between the copolymer surface and the polyurethane adhesive was chosen. Five types of low-temperature low-pressure RF plasma, two inert plasmas (Ar and He), and three reactive plasmas (O2, CO2, and CCl4) were tested. It was found that for all these types of plasma, the peel strength with the plasma treatment time first increases rapidly reaching a maximum value, and then there is a visible decrease in peel strength, after which the peel strength increases again. This dependence of the peel strength on the plasma treatment time is very well described by the proposed model, which considers three processes: (1) the generation of radical states followed by the creation of functional groups involved in the adhesive bonding process, (2) the surface cross-linking that decreases the concentration of these functional groups, and (3) the formation of nano-roughness. The model analysis revealed differences between the action of reactive and inert plasmas in the SBS surface cross-linking mechanism and preferential etching process, as well as differences in the generation of radical states between the O2 plasma (electron process) and other plasmas tested (ionic processes). |
Databáze: | OpenAIRE |
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