| Autor: |
Yu-Jung Cha, Dong Kyu Lee, Joon Seop Kwak |
| Rok vydání: |
2021 |
| Předmět: |
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| Zdroj: |
Journal of Nanoscience and Nanotechnology. 21:3721-3728 |
| ISSN: |
1533-4880 |
| Popis: |
We study the effect of thermal interface material such as thermal-conductive plastic on the dissipation of generated heat from the light-emitting diodes (LEDs) based headlamp for the application of environment-friendly green energy in vehicles. The thermal distribution and the performances of thermal-conductive plastic with heatsink are consistently investigated by using experimental and numerical results. Various thicknesses of thermal-conductive plastics from 0.3 mm to 1.0 mm used in this research work. Basically the thermal-conductive plastic reduces the thermal interface resistance between the contact of two solid surfaces. As a result, High electrical power of about 15 W (1 A and 15 V) can be possible for applying to the high-power LED package without any damage. The soldering temperature of LED package without thermal-conductive plastic shows approximately 138.7 °C which is higher compared to the LED package with thermal-conductive plastic (124.3 °C). On the other hand, the soldering temperature increases from 124.3 to 127.6 °C with increasing the thicknesses of thermal-conductive plastic. In addition, the soldering temperature decreases from 138.7 to 124.3 °C with increasing the thermal conductivities of thermal-conductive plastic. Finally, a highly thermal conductive property of thermal-conductive plastic will propose for optimum dissipation of generated heat from the LEDs-based headlamp. We also successfully estimate the junction temperature of packaged LEDs by using soldering temperature. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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