Study of microstructure evolution and properties of Cu-Fe microcomposites produced by a pre-alloyed powder method
| Autor: | Kimio Wakoh, Yunping Li, Shun Ito, Akihiko Chiba, Fenglin Wang, Yuichiro Koizumi, Kenta Yamanaka |
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| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Materials science Scanning electron microscope Mechanical Engineering Metallurgy Alloy 02 engineering and technology engineering.material 021001 nanoscience & nanotechnology Microstructure 01 natural sciences Mechanics of Materials Electrical resistivity and conductivity Phase (matter) Powder metallurgy 0103 physical sciences lcsh:TA401-492 engineering lcsh:Materials of engineering and construction. Mechanics of materials General Materials Science 0210 nano-technology Electron backscatter diffraction Tensile testing |
| Zdroj: | Materials & Design, Vol 126, Iss, Pp 64-72 (2017) |
| ISSN: | 0264-1275 |
| DOI: | 10.1016/j.matdes.2017.04.017 |
| Popis: | In this work, Cu-based microcomposites were fabricated by powder metallurgy of gas-atomized Cu-15wt% Fe alloy powder, followed by drawing to various strains. The microstructure evolution and the resultant mechanical and electrical properties were investigated by scanning electron microscopy, electron backscatter diffraction, and tensile testing, among other techniques. The results indicated that during drawing, the Fe phase evolved into nanoscale filaments along the longitudinal direction. With increasing drawing strain, both the Cu grains and the Fe filaments were refined gradually, giving rise to a mean thickness of approximately 25nm for the Fe filaments at a total strain of 4.0. The iron oxides particles formed due to contamination of oxygen maintained unchanged during drawing process. In addition, it was found that an intermediate aging during the drawing can significantly enhance the electrical conductivity of the microcomposites without sacrificing their strength. The present process involving an initial powder with a homogenous distribution of Cu and fine Fe phases makes it possible to obtain microcomposites with an ideal combination of electrical and mechanical properties at lower drawing strain, compared to those produced by conventional casting methods. Keywords: Cu-Fe microcomposite, In situ technique, Hot consolidation, Electrical conductivity, Strength, Microstructure evolution |
| Databáze: | OpenAIRE |
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