Thermal mapping at the cell level of chips in power modules through the silicone gel using thermoreflectance
| Autor: | Y. Metayrek, Zoubir Khatir, T. Kociniewski |
|---|---|
| Přispěvatelé: | Technologies pour une Electro-Mobilité Avancée (SATIE-TEMA), Composants et Systèmes pour l'Energie Electrique (CSEE), Systèmes et Applications des Technologies de l'Information et de l'Energie (SATIE), École normale supérieure - Rennes (ENS Rennes)-Conservatoire National des Arts et Métiers [CNAM] (CNAM)-Université Paris-Saclay-Centre National de la Recherche Scientifique (CNRS)-Ecole Normale Supérieure Paris-Saclay (ENS Paris Saclay)-Université Gustave Eiffel-CY Cergy Paris Université (CY)-École normale supérieure - Rennes (ENS Rennes)-Conservatoire National des Arts et Métiers [CNAM] (CNAM)-Université Paris-Saclay-Centre National de la Recherche Scientifique (CNRS)-Ecole Normale Supérieure Paris-Saclay (ENS Paris Saclay)-Université Gustave Eiffel-CY Cergy Paris Université (CY)-Systèmes et Applications des Technologies de l'Information et de l'Energie (SATIE), École normale supérieure - Rennes (ENS Rennes)-Conservatoire National des Arts et Métiers [CNAM] (CNAM)-Université Paris-Saclay-Centre National de la Recherche Scientifique (CNRS)-Ecole Normale Supérieure Paris-Saclay (ENS Paris Saclay)-Université Gustave Eiffel-CY Cergy Paris Université (CY)-École normale supérieure - Rennes (ENS Rennes)-Conservatoire National des Arts et Métiers [CNAM] (CNAM)-Université Paris-Saclay-Centre National de la Recherche Scientifique (CNRS)-Ecole Normale Supérieure Paris-Saclay (ENS Paris Saclay)-Université Gustave Eiffel-CY Cergy Paris Université (CY), Groupe d'Etude de la Matière Condensée (GEMAC), Université de Versailles Saint-Quentin-en-Yvelines (UVSQ)-Centre National de la Recherche Scientifique (CNRS) |
| Rok vydání: | 2020 |
| Předmět: |
Materials science
Optical fiber 02 engineering and technology Dielectric IGBT MODULE POWER DEVICE 01 natural sciences Temperature measurement law.invention chemistry.chemical_compound Silicone law Power electronics 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Electrical and Electronic Engineering Safety Risk Reliability and Quality 010302 applied physics business.industry 020208 electrical & electronic engineering Insulated-gate bipolar transistor equipment and supplies Condensed Matter Physics Chip Atomic and Molecular Physics and Optics THERMAL CHARACTERIZATION [SPI.TRON]Engineering Sciences [physics]/Electronics Surfaces Coatings and Films Electronic Optical and Magnetic Materials chemistry Power module Optoelectronics business |
| Zdroj: | Microelectronics Reliability Microelectronics Reliability, Elsevier, 2020, 105, ⟨10.1016/j.microrel.2019.113563⟩ |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2019.113563 |
| Popis: | Silicone gel is used in power electronics in order to provide a chemical protection and dielectric insulation in insulated gate bipolar transistor (IGBT) power modules. This gel prevents the direct mapping of surface temperature measurements of the component by classical infrared means. The temperature maps inside IGBT modules are usually performed after removal of the silicone gel which does not allow their operation in real environment. In this paper, we explore the ability of thermoreflectance to overcome this limitation in measuring the temperature surface of an IGBT chip through the silicone gel. Thermoreflectance is a non-contact technique, which measures temperature variation through reflectivity variation measurement. Using a “mean” calibration coefficient determinates from optical fiber thermal measurements, thermal images of IGBT modules with and without silicone gel can be compared. Preliminary results indicate that thermoreflectance enables the measurement of surface temperature change on high power IGBT modules with silicone gel and temperature distribution is affected by the presence of the gel. |
| Databáze: | OpenAIRE |
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