Effective Maintenance by Reducing Failure-Cause Misdiagnosis in Semiconductor Industry (SI)

Autor: Eric Zama¨ı, Muhammad Kashif Shahzad, Asma Abu-Samah, St´ephane Hubac
Přispěvatelé: Gestion et Conduite des Systèmes de Production (G-SCOP_GCSP), Laboratoire des sciences pour la conception, l'optimisation et la production (G-SCOP), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Institut National Polytechnique de Grenoble (INPG)-Centre National de la Recherche Scientifique (CNRS)-Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Institut National Polytechnique de Grenoble (INPG)-Centre National de la Recherche Scientifique (CNRS), Système d’Information, conception RobustE des Produits (G-SCOP_SIREP), STMicroelectronics [Crolles] (ST-CROLLES), Abu Samah, Asma
Jazyk: angličtina
Rok vydání: 2015
Předmět:
0209 industrial biotechnology
Engineering
Process (engineering)
[SPI] Engineering Sciences [physics]
Energy Engineering and Power Technology
diagnostic
02 engineering and technology
Fault detection and isolation
Systems engineering
TA168
[SPI]Engineering Sciences [physics]
020901 industrial engineering & automation
Reliability (semiconductor)
bayesian networks
0202 electrical engineering
electronic engineering
information engineering

Computer Science (miscellaneous)
Production (economics)
Safety
Risk
Reliability and Quality

Civil and Structural Engineering
Utilization
business.industry
Mechanical Engineering
semiconductor industry
TA213-215
Reliability engineering
maintenance actions effectiveness
Product (business)
Identification (information)
Engineering machinery
tools
and implements

Learning curve
020201 artificial intelligence & image processing
business
unscheduled maintenance
Zdroj: International Journal of Prognostics and Health Management
International Journal of Prognostics and Health Management, Prognostics and Health Management Society, 2015, International Journal of Prognostics and Health Management 2015, 6 (009), pp.18
International Journal of Prognostics and Health Management, Vol 6, Iss 1 (2015)
Scopus-Elsevier
ISSN: 2153-2648
Popis: International audience; Increasing demand diversity and volume in semiconductor industry (SI) have resulted in shorter product life cycles. This competitive environment, with high-mix low-volume production , requires sustainable production capacities that can be achieved by reducing unscheduled equipment breakdowns. The fault detection and classification (FDC) is a well-known approach, used in the SI, to improve and stabilize the production capacities. This approach models equipment as a single unit and uses sensors data to identify equipment failures against product and process drifts. Besides its successful deployment for years, recent increase in unscheduled equipment breakdown needs an improved methodology to ensure sustainable capacities. The analysis on equipment utilization , using data collected from a world reputed semiconductor manufacturer, shows that failure durations as well as number of repair actions in each failure have significantly increased. This is an evidence of misdiagnosis in the identification of failures and prediction of its likely causes. In this paper, we propose two lines of defense against unstable and reducing production capacities. First, equipment should be stopped only if it is suspected as a source for product and process drifts whereas second defense line focuses on more accurate identification of failures and detection of associated causes. The objective is to facilitate maintenance engineers for more accurate decisions about failures and repair actions, upon an equipment stoppage. In the proposed methodology, these two lines of defense are modeled as Bayesian network (BN) with unsupervised learning of structure using data collected from the variables (classified as symptoms) across production, process , equipment and maintenance databases. The proofs of Asma Abu-Samah et al. This is an open-access article distributed under the terms of the Creative Commons Attribution 3.0 United States License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited. concept demonstrate that contextual or statistical information other than FDC sensor signals, used as symptoms, provide reliable information (posterior probabilities) to find the source of product/process quality drifts, a.k.a. failure modes (FM), as well as potential failure and causes. The reliability and learning curves concludes that modeling equipment at module level than equipment offers 45% more accurate diagnosis. The said approach contributes in reducing not only the failure durations but also the number of repair actions that has resulted in recent increase in unstable production capacities and unscheduled equipment breakdowns.
Databáze: OpenAIRE