Thermal Neutron Absorption in Printed Circuit Boards
| Autor: | Michael Anderson, Shaun August, Michael MacLeod, Simon P. Platt, David Cheneler, Stephen David Monk |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
Nuclear and High Energy Physics
Materials science 010308 nuclear & particles physics Attenuation chemistry.chemical_element Substrate (printing) Neutron scattering 01 natural sciences Neutron temperature Printed circuit board Nuclear Energy and Engineering chemistry 0103 physical sciences Neutron Electrical and Electronic Engineering Composite material Absorption (electromagnetic radiation) Boron |
| Zdroj: | IEEE Transactions on Nuclear Science. 68:463-469 |
| ISSN: | 1558-1578 0018-9499 |
| DOI: | 10.1109/tns.2021.3060864 |
| Popis: | Measurements and simulations of thermal neutron attenuation by printed circuit boards are compared. Attenuation coefficients in typical epoxy-resin/glass-fibre substrate material can be as high as 2 cm-1, corresponding to 27% attenuation by 1.6 mm of substrate. Attenuation is attributed to neutron scattering off hydrogen in the resin acting in synergy with absorption by boron in the glass; this effect is substantially greater than that estimated from absorption by boron alone. Design of thermal neutron detector assemblies should take this attenuation into account and may require board thickness to be minimised or specialised substrate materials to be used. |
| Databáze: | OpenAIRE |
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