Observation of Highly Durable Silicone Resin for Encapsulating AlGaN-Based UVB Light-Emitting Diodes
| Autor: | Wen-Hong Sun, Mu-Jen Lai, Ray-Ming Lin, Yi-Tsung Chang, Rui-Sen Liu, Jian-Bin Wu, Xiong Zhang, Lung-Chien Chen, Shih-Ming Huang, Tsung-Yen Liu |
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| Jazyk: | angličtina |
| Rok vydání: | 2021 |
| Předmět: |
Technology
Materials science QH301-705.5 QC1-999 medicine.disease_cause law.invention chemistry.chemical_compound Lead frame Silicone law ultraviolet medicine General Materials Science Ceramic Composite material Biology (General) Instrumentation QD1-999 Diode degradation Fluid Flow and Transfer Processes chemistry.chemical_classification Process Chemistry and Technology Physics General Engineering package Engineering (General). Civil engineering (General) light emitting diodes Computer Science Applications Chemistry chemistry AlGaN Silicone resin visual_art visual_art.visual_art_medium silicone Degradation (geology) encapsulation TA1-2040 Ultraviolet Light-emitting diode |
| Zdroj: | Applied Sciences, Vol 11, Iss 9278, p 9278 (2021) Applied Sciences Volume 11 Issue 19 |
| ISSN: | 2076-3417 |
| Popis: | In this paper, we report an AlN-based ceramic lead frame (LF) with encapsulating silicone between the surface of an AlGaN-based ultraviolet-B light-emitting diode (UVB-LED) chip and a quartz glass cover the light output power (LOP) of this structure was 13.8% greater than that of the corresponding packaging structure without encapsulating silicone. Another packaging structure in which the silicone fully filled the cavity of the AlN-based ceramic LF included covering with quartz glass in this case, the enhancement of the LOP was 11.7%. Reliability tests performed over a period of 3500 h at a forward current (If) of 100 mA revealed that the LOPs of these two silicone-containing packaging types decreased to 45.3 and 48.6%, respectively, of their initial values. The different degradation rates of these UVB-LEDs were not, however, correlated with the appearance of cracks in the encapsulating silicone during long-term operation. Excluding any possible mechanisms responsible for degradation within the UVB-LED chips, we suggest that the hermetic cover should be removed to avoid the appearance of cracks. Moreover, the main mechanism responsible for the slow degradation rates of LOPs in these proposed packaging structures involves the encapsulated silicone, after cracks have appeared, undergoing further deterioration by the UVB irradiation. |
| Databáze: | OpenAIRE |
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