Phase‐Change Logic via Thermal Cross‐Talk for Computation in Memory
| Autor: | Nadim H. Kan'an, Helena Silva, Zachary Woods, Ali Gokirmak, Raihan Sayeed Khan |
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| Rok vydání: | 2020 |
| Předmět: |
010302 applied physics
Coupling Condensed Matter - Materials Science Materials science Computation Materials Science (cond-mat.mtrl-sci) FOS: Physical sciences Hardware_PERFORMANCEANDRELIABILITY Function (mathematics) Condensed Matter Physics 01 natural sciences Footprint (electronics) Reduction (complexity) CMOS 0103 physical sciences Hardware_INTEGRATEDCIRCUITS Electronic engineering General Materials Science Routing (electronic design automation) Voltage |
| Zdroj: | physica status solidi (RRL) – Rapid Research Letters. 15:2000422 |
| ISSN: | 1862-6270 1862-6254 |
| DOI: | 10.1002/pssr.202000422 |
| Popis: | We have computationally demonstrated logic function implementations using lateral and vertical multi-contact phase change devices integrated with CMOS circuitry, which use thermal cross-talk as a coupling mechanism to implement logic functions at smaller CMOS footprints. Thermal-crosstalk during the write operations is utilized to recrystallize the previously amorphized regions to achieve toggle operations. Amorphized regions formed between different pairs of write contacts are utilized to isolate read contacts. Typical expected reduction in CMOS footprint is ~ 50% using the described approach for toggle-multiplexing, JK-multiplexing and 2x2 routing. The switching speeds of the phase change devices are in the order of nanoseconds and are inherently non-volatile. An electro-thermal modeling framework with dynamic materials models are used to capture the device dynamics, and current and voltage requirements. 7 pages, 6 figures |
| Databáze: | OpenAIRE |
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