Towards a methodology for analysis of interconnect structures for 3D-integration of micro systems

Autor: Günter Elst, Peter Schneider, Andreas Wilde, Peter Schwarz, Sven Reitz
Přispěvatelé: Lab Design Automation, Fraunhofer Institute for Integrated Circuits (Fraunhofer IIS), Fraunhofer (Fraunhofer-Gesellschaft)-Fraunhofer (Fraunhofer-Gesellschaft), Publica
Rok vydání: 2008
Předmět:
Zdroj: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
DTIP 2007
DTIP 2007, Apr 2007, Stresa, lago Maggiore, Italy. pp.162-168
ISSN: 1573-1979
0925-1030
DOI: 10.1007/s10470-008-9143-3
Popis: Functional aspects as well as the influence of integration technology on the system behavior have to be considered in the 3D integration design process of micro systems. Therefore, information from different physical domains has to be provided to designers. Due to the variety of structures and effects of different physical domains, efficient modeling approaches and simulation algorithms have to be combined. The paper describes a modular approach which covers detailed analysis with PDE solvers and model generation for system level simulation.
Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing)
Databáze: OpenAIRE