Towards a methodology for analysis of interconnect structures for 3D-integration of micro systems
Autor: | Günter Elst, Peter Schneider, Andreas Wilde, Peter Schwarz, Sven Reitz |
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Přispěvatelé: | Lab Design Automation, Fraunhofer Institute for Integrated Circuits (Fraunhofer IIS), Fraunhofer (Fraunhofer-Gesellschaft)-Fraunhofer (Fraunhofer-Gesellschaft), Publica |
Rok vydání: | 2008 |
Předmět: |
[INFO.INFO-AR]Computer Science [cs]/Hardware Architecture [cs.AR]
FOS: Computer and information sciences Engineering Other Computer Science (cs.OH) [INFO.INFO-OH]Computer Science [cs]/Other [cs.OH] 02 engineering and technology Computer Science - Other Computer Science 0202 electrical engineering electronic engineering information engineering Parasitic extraction Interconnection business.industry Modeling CAD Tools for MEMS Control engineering System-level simulation Modular design 021001 nanoscience & nanotechnology Finite element method 020202 computer hardware & architecture Surfaces Coatings and Films Variety (cybernetics) Hardware and Architecture Signal Processing Design process 0210 nano-technology business Simulation |
Zdroj: | Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS DTIP 2007 DTIP 2007, Apr 2007, Stresa, lago Maggiore, Italy. pp.162-168 |
ISSN: | 1573-1979 0925-1030 |
DOI: | 10.1007/s10470-008-9143-3 |
Popis: | Functional aspects as well as the influence of integration technology on the system behavior have to be considered in the 3D integration design process of micro systems. Therefore, information from different physical domains has to be provided to designers. Due to the variety of structures and effects of different physical domains, efficient modeling approaches and simulation algorithms have to be combined. The paper describes a modular approach which covers detailed analysis with PDE solvers and model generation for system level simulation. Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing) |
Databáze: | OpenAIRE |
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