FE simulation of the curing behavior of the epoxy adhesive Hysol EA-9321
| Autor: | Jean Yves Cognard, Romain Créac'Hcadec, Florian Lavelle, O. Devaux, K. Mathis |
|---|---|
| Přispěvatelé: | MMA, Laboratoire brestois de mécanique et des systèmes (LBMS), École Nationale d'Ingénieurs de Brest (ENIB)-Université de Brest (UBO)-École Nationale Supérieure de Techniques Avancées Bretagne (ENSTA Bretagne)-École Nationale d'Ingénieurs de Brest (ENIB)-Université de Brest (UBO)-École Nationale Supérieure de Techniques Avancées Bretagne (ENSTA Bretagne), École Nationale d'Ingénieurs de Brest (ENIB)-Université de Brest (UBO)-École Nationale Supérieure de Techniques Avancées Bretagne (ENSTA Bretagne), Centre National d'Études Spatiales [Toulouse] (CNES) |
| Jazyk: | angličtina |
| Rok vydání: | 2015 |
| Předmět: |
Materials science
Polymers and Plastics General Chemical Engineering 02 engineering and technology 010402 general chemistry 021001 nanoscience & nanotechnology Adhesively-bonded joints 01 natural sciences Isothermal process Finite element method 0104 chemical sciences Fe simulation Biomaterials [SPI]Engineering Sciences [physics] Polymerization Thermal Adhesive Thermal analysis Composite material 0210 nano-technology Curing degree Curing (chemistry) |
| Zdroj: | International Journal of Adhesion and Adhesives International Journal of Adhesion and Adhesives, Elsevier, 2015, 60, pp.31-46. ⟨10.1016/j.ijadhadh.2015.03.005⟩ |
| ISSN: | 0143-7496 |
| DOI: | 10.1016/j.ijadhadh.2015.03.005⟩ |
| Popis: | International audience; Cold-curing adhesives, characterized by an unsteady curing degree, present various advantages for assembling large scale structures set up under outdoor conditions. Thus various applications can be found in aerospace and automotive industries where structures are affected by thermal and mechanical loads. Hence, the curing state of the adhesive must be known to evaluate the lifetime of such bonded structures. The evolution of the polymerization of the adhesive Hysol EA-9321 during the curing process was examined in this paper. To that end, the curing degree of the adhesive was experimentally and analytically investigated for different curing cycles with a view to a potential application in the aerospace domain, where structures are assembled at low temperatures. Existing dynamic and isothermal curing models were applied to simulate the curing behavior of the adhesive. Then, an FEM model was developed to simulate the process of adhesive curing by taking into account a thermo-kinetic coupling. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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