IEEE SA industry connections 3D body processing working group and IEEE P3141 standard for 3D body processing - Part 2

Autor:	Carol McDonald, Randy K Rannow, Dinesh Pai, Alice Bullas, Alfredo Ballester
Jazyk:	angličtina
Rok vydání:	2020
Předmět:	Human-Computer Interaction Standards Metadata Hardware and Architecture Three-dimensional displays Integrated circuits Consumer electronics Electrical and Electronic Engineering Industries Footwear Computer Science Applications
Zdroj:	RiuNet. Repositorio Institucional de la Universitat Politécnica de Valéncia instname
ISSN:	2162-2248
Popis:	The IEEE 3D Body Processing Industry Connections Working Group (3DBP IC) brings together a diverse group of stakeholders including computer scientists, research and development personnel, 3D body scanner vendors, retailers and associated consultants, individuals from adjacent markets, and thought leaders around 3D body processing technologies (3D capture, processing, storage, sharing, and virtualization).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_dedup___::49a0ba667f79b46b71094a50dee98130 https://shura.shu.ac.uk/30104/3/Bullas-IEEESAIndustryConnections(AM).pdf Zobrazit plný text záznamu