A Semiconductor IC Packaging Solution for Device Miniaturization
| Autor: | Gomez, Frederick Ray I., Rennier S. Rodriguez |
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| Rok vydání: | 2019 |
| Předmět: | |
| DOI: | 10.5281/zenodo.3461582 |
| Popis: | Miniaturization and densification is the current roadmap of all semiconductor devices. Downsizing or decreasing the size of a semiconductor integrated circuit (IC) as depicted |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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