Modeling and Frequency Performance Analysis of Through Silicon Capacitors in Silicon Interposers
| Autor: | Yann Lamy, Anne-Laure Perrier, Khadim Dieng, Olivier Guiller, Bernard Flechet, Alexis Farcy, Philippe Artillan, Cedric Bermond, Thierry Lacrevaz, Grégory Houzet, Sylvain Joblot |
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| Přispěvatelé: | Institut de Microélectronique, Electromagnétisme et Photonique - Laboratoire d'Hyperfréquences et Caractérisation (IMEP-LAHC ), Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Université Savoie Mont Blanc (USMB [Université de Savoie] [Université de Chambéry])-Centre National de la Recherche Scientifique (CNRS)-Université Grenoble Alpes [2016-2019] (UGA [2016-2019]), Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI), Direction de Recherche Technologique (CEA) (DRT (CEA)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA), Centre de recherche sur l'hétéroepitaxie et ses applications (CRHEA), Université Nice Sophia Antipolis (1965 - 2019) (UNS), COMUE Université Côte d'Azur (2015-2019) (COMUE UCA)-COMUE Université Côte d'Azur (2015-2019) (COMUE UCA)-Centre National de la Recherche Scientifique (CNRS)-Université Côte d'Azur (UCA), STMicroelectronics [Crolles] (ST-CROLLES), Université Nice Sophia Antipolis (... - 2019) (UNS) |
| Rok vydání: | 2017 |
| Předmět: |
Materials science
Silicon Hybrid silicon laser Silicon on insulator chemistry.chemical_element 02 engineering and technology 7. Clean energy 01 natural sciences Industrial and Manufacturing Engineering law.invention [SPI]Engineering Sciences [physics] Back end of line Hardware_GENERAL law 0103 physical sciences Hardware_INTEGRATEDCIRCUITS 0202 electrical engineering electronic engineering information engineering Electronic engineering Electrical and Electronic Engineering Electrical conductor 010302 applied physics 020208 electrical & electronic engineering Electronic Optical and Magnetic Materials Capacitor chemistry Interposer Decoupling (electronics) |
| Zdroj: | IEEE Transactions on Components Packaging and Manufacturing Technology Part B IEEE Transactions on Components Packaging and Manufacturing Technology Part B, 2017, 7 (4), pp.477-484. ⟨10.1109/TCPMT.2017.2655939⟩ IEEE Transactions on Components Packaging and Manufacturing Technology Part B, Institute of Electrical and Electronics Engineers (IEEE), 2017, 7 (4), pp.477-484. ⟨10.1109/TCPMT.2017.2655939⟩ |
| ISSN: | 2156-3985 2156-3950 1070-9894 |
| Popis: | International audience; The feasibility of cointegration of new capacitors, named “through silicon capacitors” (TSCs) with “through silicon vias” in silicon interposers has recently been demonstrated. Two architectures of TSC are extensively investigated in this paper: “axial TSC” whose electrodes are connected on either sides of the silicon interposer and “radial TSC” with electrodes both connected to the metal layers of the back end of line. A general modeling method based on distributed cell segmentation is proposed for both architectures. Validation is performed by measurements from 1 kHz to 40 GHz (above the resonance frequency of the components). A comparative study between radial and axial architectures is performed, leading to the prediction of the performances of those new components. Finally, design rules are established for future integration for power delivery networks decoupling applications. |
| Databáze: | OpenAIRE |
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