Availability of parts and definition of technologies for wafer-to-wafer hybridization

Autor:	F. Huegging, T. Fritzsch
Rok vydání:	2023
Předmět:	WP6
DOI:	10.5281/zenodo.7515666
Popis:	Within WP6 (Hybrid Pixel Sensors for 4D Tracking and Interconnection Technologies) Milestone MS25 contains the availability of parts and definition of technologies for wafer-to-wafer hybridization. This milestone has been successfully achieved and is reported in this document.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_dedup___::46349456f1d97d95cd1a444b0f76801e Zobrazit plný text záznamu