Process and Design Optimization of Electronic Package with Complex Stacked Dice Configuration
| Autor: | Rennier S. Rodriguez, Gomez, Frederick Ray I. |
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| Rok vydání: | 2019 |
| DOI: | 10.5281/zenodo.3483891 |
| Popis: | Package design is one of the key steps prior fabrication and assembly of semiconductor electronic devices. This paper presents the advantage of securing a robust design architecture for specailized electronic devices to minimize the potential show stopper in the realization of high-end technology during assembly manufacturing. |
| Databáze: | OpenAIRE |
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